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      MEMSIC MDP 200 MEMS-Based Pressure Sensor Uses Thermal Differential for Sensing

      MEMSIC MDP 200 MEMS-Based Pressure Sensor Uses Thermal Differential for Sensing

      04.08.2017 17:13

      MEMS-Based Pressure Sensor Uses Thermal Differential for Sensing

      Designed for VAV damper control as well as HVAC applications such as room pressure monitoring, fume hood controls, furnace press switches, heat recovery systems, burner control, fan control, filter monitoring and more, the MDP200 Pressure Sensor from MEMSIC Inc. is an integrated MEMS thermal differential pressure sensor. The sensor utilizes thermopile structures similar to the company’s well established MEMS accelerometers.

      Using CMOS compatible technology, the pressure sensing chip has a central heater source (micro heater) and two temperature sensors (thermopiles) to detect the pressure. Additional integrated circuitry allows easy interfacing into the targeted applications

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